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Thermal Load Stability
Heat Coefficient Dimensional Stability at Continuous Thermal Load The dimensional stability under continuous thermal load is a very important criterion for thermal insulation or machine components. This is defined as the temperature at which the material does not shrink more than one percent after 5,000 hours of exposure. An organic material rated at 450xF temperature stability at room temperature will only be dimensionally stable up to 390xF while under continuous thermal load. An inorganic material rated 156xF also will dimensionally stable up to 1,560xF. Compressive Strength at Maximum Operating Temperature Compressive strength of materials is usually measured at room temperature, which is 20xC (68xF). It is generally known that this factor goes down with higher temperatures. In practice, compressive loads are usually much lower - a built-in safety factor. The same organic material with a dimensional stability of 390xF will have a compressive strength of 300 N/mm² at room temperature, but only 100 N/mm² at 390xF. The inorganic material of 1,560xF only has a compressive strength of 10N/mm² at room temperature, which remains the same under continuous thermal load. Grade selection has to be based on specifications given for the equipment and production process - such as operating pressures and temperatures. Manufacturers of insulation furnish charts to aid with this selection. Moisture Absorption Tolerances It should be mentioned that thermal insulation panels are rarely ever used at room temperature. Change of dimension does not occur through thermal expansion, but through permanent changes such as drying, post-curing processes, long-term oxidative decay, etc. Nevertheless, most panel grades can be supplied with a parallelism of q0.05 mm = 1/500 inch.
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